On the nature of Machining Cracks in Ground Ceramics: Part II, Comparison to Other Silicon Nitrides and Damage Maps

G. D. Quinn, L. K. Ives, and S. Jahanmir, “On the nature of Machining Cracks in Ground Ceramics: Part II, Comparison to Other Silicon Nitrides and Damage Maps,” Machining Science and Technology, 9 (2005) 211-237.

The size and severity of grinding machining cracks in a sintered reaction bonded silicon nitride from part I are compared to data for other silicon nitrides. Crack sizes follow a similar trend with grinding wheel grit size despite differences in microstructures, strengths, and fracture toughnesses. Silicon nitrides with enhanced fracture toughness actually develop deeper machining cracks than cracks in less tough silicon nitrides. Machining damage maps for silicon nitride are devised.